1 Built in Germany Infineon IGBT module.
2 America new generation GSP chip technology.
3 50 engineers R&D teams, self-design and innovation mother board circuit, system.
4 12years factory manufacturer experience, customer feedback & continuing improvement.
5 design lifespan more than 10 years.
RoHS, CE , ISO90001
2 America new generation GSP chip technology.
3 50 engineers R&D teams, self-design and innovation mother board circuit, system.
4 12years factory manufacturer experience, customer feedback & continuing improvement.
5 design lifespan more than 10 years.
RoHS, CE , ISO90001
1 Built in six Germany Infineon IGBT module
2 America new generation GSP chip technology
3 30 engineers R&D teams, self-design and innovation mother board circuit, system
2 America new generation GSP chip technology
3 30 engineers R&D teams, self-design and innovation mother board circuit, system
1 Built in six Germany Infineon IGBT module
2 America new generation GSP chip technology
3 50 engineers R&D teams, self-design and innovation mother board circuit, system
4 12years factory manufacturer experience, customer feedback & continuing improvement
* high-end * more safe * more stable *long lifespan
2 America new generation GSP chip technology
3 50 engineers R&D teams, self-design and innovation mother board circuit, system
4 12years factory manufacturer experience, customer feedback & continuing improvement
* high-end * more safe * more stable *long lifespan